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| AMMP-6232 8 to 32 GHz GaAs High Linearity LNA in SMT Package Data Sheet Description Avago's AMMP-6232 is an easy-to-use broadband, high gain,highlinearityLowNoiseAmplifierinasurfacemount package. The wide band and unconditionally stable performancemakesthisMMICidealasaprimaryorsubsequentiallownoiseblockoratransmitterdriver.TheMMIC has4gainstagesandrequiresa4V,138mApowersupply for optimal performance. Since this MMIC covers several bands,itcanreducepartinventoryandincreasevolume purchase options The MMIC is fabricated using PHEMT technology. The surface mount package eliminates the needof"chip&wire"assemblyforlowercost.ThisMMICis fullySMTcompatiblewithbacksidegroundingandI/Os. Features * * * * * * * * * * * * SurfaceMountPackage,5.0x5.0x1.25mm SinglePowerSupplyPin UnconditionallyStable 50OhmInputandOutputMatch Specifications (Vdd = 4.0V, Idd = 138mA) RFFrequencies:18-32GHz HighOutputIP3:29dBm HighSmall-SignalGain:23dB TypicalNoiseFigure:3dB Pin Connections (Top View) 1 2 3 100pF Applications Pin 1 2 3 4 5 6 7 8 Function Vdd RFout Vg RFin 8 100pF 4 7 6 5 MicrowaveRadiosystems SatelliteVSAT,DBSUp/DownLink LMDS&Pt-PtmmWLongHaul BroadbandWirelessAccess (including802.16and802.20WiMax) * WLLandMMDSloops * Commercialgrademilitary Note: 1. ThisMMICusesdepletionmodepHEMTdevices. 2. Negativevoltageisusedforthegatebias Topview Packagebase:GND Attention: Observe precautions for handling electrostatic sensitive devices. ESD Machine Model (Class A) ESD Human Body Model (Class 1A) Refer to Avago Application Note A004R: Electrostatic Discharge Damage and Control Absolute Maximum Ratings [1] Parameters / Conditions Drain to Ground Voltage Gate-Drain Voltage Drain Current Gate Bias Voltage Gate Bias Current RF CW Input Power Max Max channel temperature Storage temperature Maximum Assembly Temp Symbol Vdd Vgd Idd Vg Ig Pin Tch Tstg Tmax Unit V V mA V mA dBm C C C Max 5.5 -8 200 +0.8 0 +50 -65 +50 260 for 20s 1. Operationinexcessofanyoftheseconditionsmayresultinpermanentdamagetothisdevice.TheabsolutemaximumratingsforVdd,Vgd,Idd, Vg,IgandPinweredeterminedatanambienttemperatureof25Cunlessnotedotherwise. DC Specifications/ Physical Properties [2] Parameter and Test Condition Drain Supply Current (Vd=4.0 V) Drain Supply Voltage Gate Bias Current Gate Bias Voltage Thermal Resistance(3) Symbol Idd Vd Ig Vg jc Unit mA V mA V C/W -. 3 Min Typ 35 4 0. -0.95 35. -0.8 Max 50 5 2. AmbientoperationaltemperatureTA=25Cunlessnoted 3. Channel-to-backside Thermal Resistance (Tchannel = 34C) as measured using infrared microscopy. Thermal Resistance at backsidetemp.(Tb)=25Ccalculatedfrommeasureddata. AMMP-6232 RF Specifications [4] TA=25C,Vdd=4.0V,Idd=135mA,Zo=50W Parameters and Test Conditions Small-Signal Gain[5] Noise Figure into 50W[5] Output Power at dB Gain Compression Output Power at 3dB Gain Compression Output Third Order Intercept Point Isolation Input Return Loss Output Return Loss Freq. (GHz) 20, 26, 29 20, 26, 29 Symbol Gain NF P-dB Psat OIP3 Iso RLin RLout Units dB dB dBm dBm dBm dB dB dB Minimum 9 Typical 23 3 8 20 29 -45 -0 -0 4.5 Maximum Sigma 4. Refertocharacteristicplotsfordetailedindividualfrequencyperformance. 5. Alltestedparametersguaranteedwithmeasurementaccuracy1.5dBforgainand0.4dBforNF. 2 AMMP-6232 Typical Performance [1], [2] (TA=25C,Vdd=4V,Idd=138mA,Zin=Zout=50Wunlessnoted) 40 30 S21 (dB) 20 10 0 15 20 25 Frequency (GHz) 30 35 NoiseFigure (dB) 5 4 3 2 1 0 18 20 22 24 26 28 30 32 Frequency (GHz) Figure 1. Small-signal Gain 0 Figure 2. Noise Figure 20 OP1dB (dBm) 15 10 5 0 18 20 22 24 26 28 30 32 Frequency (GHz) -5 S11 (dB) -10 -15 -20 -25 15 20 25 30 35 Frequency (GHz) Figure 3. Input Return Loss 0 Figure 4. Output P-1dB 30 OIP3 (dBm) 25 20 15 10 5 18 20 22 24 26 28 30 32 -5 S22 (dB) -10 -15 -20 -25 15 20 25 Frequency (GHz) 30 35 Frequency (GHz) Figure 5. Output Return Loss Figure 6. Output IP3 Note: 1. S-parametersaremeasuredonR&DEvalBoardasshowninFigure20.Effectsofconnectorsandboardtracesareincludedinresults. 2. NoiseFigureismeasuredonR&DEvalBoardasshowninFigure20,andwitha3dBpadattheinput.BoardandConnectorlossesarealreadydeembededfromthedata. 3 AMMP-6232 Typical Performance (cont.) (TA=25C,Vdd=4V,Idd=138mA,Zin=Zout=50Wunlessnoted) -20 -30 S12 (dB) 200 170 Idd (mA) 15 20 25 Frequency (GHz) 30 35 -40 -50 -60 -70 140 110 80 50 3 3.5 4 Vdd (V) 4.5 5 Figure 7. Isolation 40 Figure 8. Total Current 5 NoiseFigure (dB) 30 S21 (dB) 20 10 0 15 20 25 30 Frequency (GHz) 4V 5V 3V 4 3 2 1 0 3V 4V 5V 18 20 22 24 26 28 30 32 35 Frequency (GHz) Figure 9. Gain over Vdd Figure 10. Noise Figure over Vdd 0 -5 -10 -15 -20 -25 15 4V 3V 5V 0 -5 S22 (dB) -10 -15 -20 -25 -30 35 S11 (dB) 4V 5V 3V 20 25 30 Frequency (GHz) 15 20 25 30 Frequency (GHz) 35 Figure 11. Input Return Loss Over Vdd Figure 12. Output Return Loss Over Vdd 4 AMMP-6232 Typical Performance (cont.) (TA=25C,Vdd=4V,Idd=138mA,Zin=Zout=50Wunlessnoted) 25 OP1dB (dBm) OIP3 (dBm) 35 30 25 20 15 10 5 3V 4V 5V 20 15 3V 10 5 18 20 22 24 26 28 4V 5V 30 32 18 20 22 24 26 28 30 32 Frequency (GHz) Frequency (GHz) Figure 13. Output P-1dB over Vdd 40 30 S21 (dB) 20 10 0 15 20 25 30 Frequency (GHz) 25C 85C -40C Figure 14. Output IP3 Over Vdd 5 NoiseFigure (dB) 4 3 2 1 0 -40C 25C 85C 35 18 20 22 24 26 28 30 32 Frequency (GHz) Figure 15. Gain over Temp 0 -5 S11 (dB) Figure 16. Noise Figure over Temp 0 -5 S22 (dB) -10 -15 -20 -25 -30 25C 85C -40C -10 -15 -20 -25 15 25C -40C 85C 20 25 30 Frequency (GHz) 35 15 20 25 30 Frequency (GHz) 35 Figure 17. Input Return Loss Over Temp Figure 18. Output Return Loss Over Temp 5 AMMP-6232 Application and Usage 4V Vdd 1 2 0.1uF Biasing and Operation The AMMP-6232 is normally biased with a positive drain supply connected to the VDD pin and a negative gate biasthroughbypasscapacitorsasshowninFigure19.The recommendeddrainsupplyvoltageis4Vandthegatebias is approximately -0.95V to get the corresponding drain current of 138mA. It is important to have 0.1uF bypass capacitors and the capacitor should be placed as close to the component as possible. Aspects of the amplifier performancemaybeimprovedoveranarrowerbandwidth by application of additional conjugate, linearity, or low noise(Topt)matching. Afteradjustingthegatebiastoobtain138mAatVdd=4V, the AMMP-6232 can be safely biased at 3V or 5V (while fixing the gate bias) as desired. At 4V, the performance isanoptimalcompromisebetweenpowerconsumption, gainandpower/linearity.Itisbothapplicabletobeused asalownoiseblockordriver.At3V,theamplifierisideal asafrontendlownoiseblockwherelinearityisnothighly required.At5V,theamplifiercanprovide1to2dBmmore output power for LO or transmitter driver applications wherehighoutputpowerandlinearityareoftenrequired. RefertheAbsoluteMaximumRatingstableforallowedDC andthermalconditions. 3 100pF IN 8 4 OUT 100pF 7 6 5 0.1uF Vg Top View Package base: GND Figure 19. Usage of the AMMP-6232 ~ -0.95V Figure 20. Evaluation/Test Board (available to qualified customer request) Vd1 Vd2 In Matching Network Matching Network Matching Network Out Vg1 Vg2 Figure 21. Simplified AMMP-6232 Schematic 6 Recommended SMT Attachment for 5x5 Package Figure 22a. Suggested PCB Land Pattern and Stencil Layout Figure 22b. Stencil Outline Drawing (mm) Figure 22c. Combined PCB and Stencil Layouts The AMMP Packaged Devices are compatible with high volumesurfacemountPCBassemblyprocesses. The PCB material and mounting pattern, as defined in thedatasheet,optimizesRFperformanceandisstrongly recommended.Anelectronicdrawingofthelandpattern isavailableuponrequestfromAvagoSales&Application Engineering. Manual Assembly * FollowESDprecautionswhilehandlingpackages. * Handlingshouldbealongtheedgeswithtweezers. * Recommendedattachmentisconductivesolderpaste. Pleaseseerecommendedsolderreflowprofile.Neither Conductiveepoxyorhandsolderingisrecommended. * Apply solder paste using a stencil printer or dot placement. The volume of solder paste will be dependentonPCBandcomponentlayoutandshould be controlled to ensure consistent mechanical and electricalperformance. * Follow solder paste and vendor's recommendations when developing a solder reflow profile. A standard profile will have a steady ramp up from room temperature to the pre-heat temp. to avoid damage duetothermalshock. * Packages have been qualified to withstand a peak temperature of 260C for 20 seconds. Verify that the profilewillnotexposedevicebeyondtheselimits. 300 250 Temp (C) 200 150 100 50 0 Ramp1 0 50 Preheat Ramp2 100 Reflow 200 Cooling 250 300 150 Seconds Peak=2505C Meltingpoint=218C Aproperlydesignedsolderscreenorstencilisrequiredto ensureoptimumamountofsolderpasteisdepositedonto thePCBpads.Therecommendedstencillayoutisshown in Figure 22. The stencil has a solder paste deposition opening approximately 70% to 90% of the PCB pad. Reducing stencil opening can potentially generate more voids underneath. On the other hand, stencil openings largerthan100%willleadtoexcessivesolderpastesmear orbridgingacrosstheI/Opads.Consideringthefactthat solder paste thickness will directly affect the quality of thesolderjoint,agoodchoiceistousealasercutstencil composedof0.127mm(5mils)thickstainlesssteelwhich iscapableofproducingtherequiredfinestenciloutline. The most commonly used solder reflow method is accomplished in a belt furnace using convection heat transfer. The suggested reflow profile for automated reflow processes is shown in Figure 23. This profile is designedtoensurereliablefinishedjoints.However,the profile indicated in Figure 1 will vary among different solderpastesfromdifferentmanufacturersandisshown hereforreferenceonly. Figure 23. Suggested Lead-Free Reflow Profile for SnAgCu Solder Paste AMMP-6232 Part Number Ordering Information Part Number AMMP-6232-BLKG AMMP-6232-TRG AMMP-6232-TR2G Devices Per Container 0 00 500 Container Antistatic bag " Reel " Reel 8 Package, Tape & Reel, and Ordering Information .011 Top View Side View Back View NOTES: DIMENSIONSAREININCHES[MILIMETERS] ALLGROUNDSMUSTBESOLDEREDTOPCBRF MaterialisRogersRO4350,0.010"thick Carrier Tape and Pocket Dimensions For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright (c) 2006 Avago Technologies Limited. All rights reserved. Obsoletes AV0-0442EN AV02-049EN - June 2, 200 |
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